王斐,母军,王作雨.基于 SolidEdge模拟瓦楞纸板三维成形的折弯问题研究[J].包装工程,2014,35(17):43-47.
WANG Fei,MU Jun,WANG Zuo-yu.Simulation of Bending Problem in the 3D Molding of Corrugated Cardboard Based on SolidEdge[J].Packaging Engineering,2014,35(17):43-47. |
| 基于 SolidEdge模拟瓦楞纸板三维成形的折弯问题研究 |
| Simulation of Bending Problem in the 3D Molding of Corrugated Cardboard Based on SolidEdge |
| 投稿时间：2014-03-05 修订日期：2014-09-01 |
| DOI： |
| 中文关键词: 瓦楞纸板 Solid Edge 折弯问题 偏置距离 |
| 英文关键词: corrugated cardboard Solid Edge bending problem offset distance |
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| 中文摘要: |
| 目的 基于 SolidEdge模拟瓦楞纸箱的三维成形效果，通过偏置折弯线，使基于钣金环境的折弯命令按照瓦楞纸箱的需求从开槽中线处折叠。 方法 提出折弯过程中存在的问题，针对一块简化的瓦楞纸板（尺寸为 150 mm× 80 mm），从折弯方式、板厚和板的幅面规格等 3 方面，分析折弯命令对其成形过程的影响，并对折弯线向固定端的偏置距离进行优化。 结果 折弯方式为“材料外侧”对折弯命令的影响最小，随着板厚的增加对折弯命令的影响加大，且初始偏置距离为 0.25（t t为板厚），板的幅面规格对折弯命令无影响。 结论 将折弯线向固定端偏置 0.26t-0.05，可以解决二维向三维成形的折弯问题。 |
| 英文摘要: |
| Objective To simulate the 3D design of the corrugated box based on Solidedge, through offset of the bending line, the bending command based on the sheet metal environment was used as the demand of corrugated box folding from the slotted midline. Methods The problems existing in the bending process were brought up, a simplified 150 mm by 80 mm corrugated cardboard was analyzed for the effect of bending command on the molding process from the aspects of bending method, thickness of the plate and board size. The offset distance moved to the fixed end of the bending line was optimized. Results The bending mode of“Outside of the material” had the minimal impact on the bending command; with the increase of the plate thickness, the effect on bending command increased, and the initial offset distance was 0.25t; the size of plate had no effect on the bending command. Conclusion If the bending line offset to the fixed end was 0.26t-0.05, the bending problem from 2D to 3D molding may be solved. |
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