包睿,仇振安,徐淑权.发射箱湿法缠绕用树脂体系黏度及固化动力学研究[J].包装工程,2015,36(17):139-143. BAO Rui,QIU Zhen-an,XU Shu-quan.Viscosity and Curing Kinetics of Resin System for Wet Winding of Launch Box[J].Packaging Engineering,2015,36(17):139-143. |
发射箱湿法缠绕用树脂体系黏度及固化动力学研究 |
Viscosity and Curing Kinetics of Resin System for Wet Winding of Launch Box |
投稿时间:2015-01-18 修订日期:2015-09-10 |
DOI: |
中文关键词: 湿法缠绕 黏度 固化动力学 固化 |
英文关键词: wet winding viscosity curing kinetics solidify |
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中文摘要: |
目的 研究液晶环氧树脂改性E-51树脂体系的黏度和固化动力学, 为发射箱湿法缠绕成形提供理论依据。方法 采用旋转黏度计测试树脂体系在25, 30和35 ℃下的静态黏度, 用非等温DTA法研究树脂体系固化动力学, 并用T-β外推法推导固化工艺参数。结果 在25, 30和35 ℃下, 8 h后树脂体系的黏度分别为1219, 1568和1789 mPa·s; 固化工艺参数为Ti=71 ℃, Tp=131 ℃, Tf=181 ℃, 并获得了固化动力学方程。结论 树脂体系黏度小于2 Pa·s, 满足发射箱湿法缠绕工艺要求, 固化工艺制度为70, 100,130和180 ℃下分别恒温固化2 h。 |
英文摘要: |
In order to provide theoretical basis for wet winding of the launch box, the article studied the viscosity and curing kinetics of E-51 resin system modified by liquid epoxy resin. The static viscosity of resin system at 25 ℃, 30 ℃ and 35 ℃ was tested by rotational viscometer, the non-isothermal curing kinetics of resin system was studied by DTA, and the parameters of the curing process were derived by T-β extrapolation. The viscosity of the resin system at 25 ℃, 30 ℃ and 35℃ respectively was 1219 mPa·s, 1568 mPa·s and 1789 mPa·s after 8 h, respectively. The curing process parameters were Ti =71 ℃, Tp =131 ℃, Tf =181 ℃. The curing kinetics equation was obtained. The viscosity of resin system was less than 2 Pa·s, meeting the process requirement of wet winding of the launch box. The curing process was curing at constant temperatures of 70 ℃,100 ℃,130 ℃and 180 ℃ for 2 h, respectively. |
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