于光,郑元丰.无卤阻燃环氧树脂在电子封装领域的研究进展[J].包装工程,2023,44(19):137-148.
YU Guang,ZHENG Yuan-feng.Research Progress of Halogen-free Flame Retardant Epoxy in Electronic Packaging[J].Packaging Engineering,2023,44(19):137-148. |
| 无卤阻燃环氧树脂在电子封装领域的研究进展 |
| Research Progress of Halogen-free Flame Retardant Epoxy in Electronic Packaging |
| 投稿时间：2023-01-15 |
| DOI：10.19554/j.cnki.1001-3563.2023.19.018 |
| 中文关键词: 无卤阻燃 环氧树脂 电子封装 阻燃机理 5G电子 |
| 英文关键词: halogen-free flame retardancy epoxy electronic packaging flame retardant mechanism 5G electronic |
| 基金项目:广东省普通高校青年创新人才类项目(2021WQNCX229) |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 综述无卤阻燃环氧树脂的最新研究进展，为开发高效阻燃封装材料提供研究思路和技术指导。方法 采用文献调研法介绍无卤阻燃环氧树脂的种类、阻燃机理，总结当前无卤阻燃环氧树脂在电子封装领域的应用现状和技术进展，并对其未来发展趋势进行展望。结果 与本征型无卤阻燃环氧树脂和反应型无卤阻燃环氧树脂相比，填充型无卤阻燃环氧树脂具有工艺简单、种类齐全、性能高效等优点，成为无卤阻燃环氧树脂中应用最广的种类。结论 无卤阻燃环氧树脂能够有效提升电子封装材料的火灾安全性，延长电子器件的使用寿命，促进5G电子器件的高速发展。 |
| 英文摘要: |
| The work aims to review the latest research progress of halogen-free flame retardant epoxy and provide research ideas and technical guidance for the development of high efficient flame retardant packaging materials. The types and mechanism of halogen-free flame retardant epoxy were introduced by literature survey, the application status and technical progress of halogen-free flame retardant epoxy in electronic packaging were summarized, and the future development trend was prospected. Compared with the intrinsic and reactive halogen-free flame retardants, the filled halogen-free flame-retardant epoxy had the advantages of simple process, complete variety and high performance, it was the most widely used halogen-free flame retardant epoxy.Halogen-free flame epoxy could effectively enhance the fire safety of electronic packaging materials, extend the service life of electronic devices and promote the rapid development of 5G electronic devices. |
|
查看全文
查看/发表评论 下载PDF阅读器 |
| 关闭 |
渝公网安备 50010702501716号